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Cég neve
ARM Hungary Kft.
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Munkavégzés helye
Hibrid -
Munkaidő, foglalkoztatás jellege
- Teljes munkaidő
- Általános munkarend
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Elvárások
- Angol középfok
- 5-10 év tapasztalat
- Egyetem
Állás elmentve
A hirdetést eltávolítottuk a mentett állásai közül.
Állás leírása
Responsibilities
Creating and analysing novel System-in-Package designs
Delivering robust design methodologies and silicon/platform electrical integrity solution spaces
Creating or supervising package designs
Running specific packaging analysis tools
Playing a tech lead role (for senior engineers)
Working closely with teams in UK, France, and other Arm locations
Participating in emerging interfaces definition
Understanding impact on Arm IP and possibly influencing the standard
Supervising lab evaluations of the on post-silicon chip, including debugging and solving system level issues
Delivering robust design methodologies and silicon/platform electrical integrity solution spaces
Creating or supervising package designs
Running specific packaging analysis tools
Playing a tech lead role (for senior engineers)
Working closely with teams in UK, France, and other Arm locations
Participating in emerging interfaces definition
Understanding impact on Arm IP and possibly influencing the standard
Supervising lab evaluations of the on post-silicon chip, including debugging and solving system level issues
Requirements
Engineering degree or equivalent
5 or more years of experience in System level Signal Integrity with focus on interfaces’ impact on systems
Proficiency with SIPI analysis environments (Ansys suite, Cadence, or other)
Deep understanding of multi-port matrixes (S, Y, Z parameters)
Good understanding of electromagnetic extraction methodologies and their limitations
Understanding of package drawing to drive design engineer and perform package drawing modifications
Ability to provide technical directions to sub-workgroups and influence key product/platform roadmap decisions
Pre-layout platform design guideline development for SI/PI interfaces
5 or more years of experience in System level Signal Integrity with focus on interfaces’ impact on systems
Proficiency with SIPI analysis environments (Ansys suite, Cadence, or other)
Deep understanding of multi-port matrixes (S, Y, Z parameters)
Good understanding of electromagnetic extraction methodologies and their limitations
Understanding of package drawing to drive design engineer and perform package drawing modifications
Ability to provide technical directions to sub-workgroups and influence key product/platform roadmap decisions
Pre-layout platform design guideline development for SI/PI interfaces
Nice-to-have
Nice to have skills: good understanding SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks), Experience in System level Power Integrity with focus on package level PI trade-offs, Experienced in complete package design flow from ball map stage up to final tape-out, Knowledge in packaging manufacturing steps and their constraints, Experience on advanced packaging (2.5D, 3D), Knowledge of Linux environment and scripting (Python, Skill,…), Interpersonal skills: mentoring other SIPI engineers, proficient in English communication, self-motivated, ready to work in worldwide team setup, attention to detail, pro-active and pragmatic problem solving, willingness to iteratively improve designs
What we offer
Hybrid working environment designed to support high performance and personal wellbeing
Flexibility in hybrid working patterns depending on team needs
Revolutionary benefits including health and wellness support, work and life success empowerment, financial rewards, and development and support
Flexibility in hybrid working patterns depending on team needs
Revolutionary benefits including health and wellness support, work and life success empowerment, financial rewards, and development and support
Company info
You know us. With 125 Arm-powered products shipped every second, more than 70% of the world’s population touches Arm technology. Our hardware engineers are a dynamic force driving innovation across various domains. Whether it’s powering your smartphone, delivering award-winning VR gaming, or developing the foundation for the world's fastest supercomputer – our engineers are designing the advanced core processors leading the race toward a connected, autonomous, hyper-performance future.
From advancing core implementation to developing full custom physical IP, Arm hardware engineering pushes the limits in vital areas, such as memory, IO, and logic, to shape the future of technology.
How to apply
You can submit your application on the company's website, which you can access by clicking the „Apply on company page“ button.
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