Graduate Signal Integrity Engineer

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ARM Hungary Kft.
Munkavégzés helye

Országos lefedettség

Munkaidő, foglalkoztatás jellege
- Teljes munkaidő
- Általános munkarend
Elvárások
- Nem kell nyelvtudás
- Nem kell tapasztalat
- Egyetem

Állás elmentve

A hirdetést eltávolítottuk a mentett állásai közül.

Responsibilities

Apply signal integrity domain expertise to influence design and perform analysis on SoC, packaging and board
Design, model and simulate SI for datacenter platforms
Perform electromagnetic extraction, frequency time domain simulation, IO link analysis
Work closely with SoC architects, package board designs to drive architectural decisions
Ensure system level performance on end-to-end solutions for memory, high-speed IO and die-to-die interfaces

Requirements

Hold (or are on track to hold) a degree or equivalent experience in Electrical Engineering (Bachelors, Masters or PhD students welcome)
Candidates with alternative degrees will also be considered if they have meaningful experience
Good knowledge of transmission line theory and electromagnetics
Proficiency in Ansys/Cadence electromagnetic extraction tools
Proficiency in spice simulation and Keysight ADS
Proficiency in PCIe, DDR, LPDDR D2D interface signaling
Proficiency in IC package and PCB layout tools

Nice-to-have

Salary Range: $126,100-$170,700 per year, Hybrid working approach designed to support high performance and personal wellbeing, Equal opportunity employer committed to diversity and inclusion

What we offer

Competitive salary
Comprehensive rewards package
Support, autonomy and opportunity to excel in your career
Mid-year and year-end review for career progression
Access to Grad-teach-Grads workshops, guest speaker series and social events
Opportunity to join Graduate Committee to develop planning, networking and coordination skills
Invitation to exclusive Global Graduate Conference (GGC)

Company info

Arm has a phenomenal opportunity for a Graduate Signal Integrity Engineer in our PBM (Packaging, Boards and Multiphysics) team! You will collaborate with IP, SoC Design, Package Design, Signal Integrity, Power Integrity, Test and Systems teams throughout the company to guide development of innovative packaging solutions within Arm. You will play a key role in developing new products in AI, automotive, networking and other growing markets using emerging packaging technologies. The role requires passionate engineering focus in areas such as signaling and signal integrity.